Metrology for Panel-Level Packaging
Production-Proven
600 mm x 600 mm - concurrent Measurements on top and bottom - high-speed Sensors
Visit our web site for more details
We offer a range of different platform sizes with a wide selection of sensor technologies to allow you to measure your samples
The CT600S Platform -
Fast full-panel Measurements:
TTV
Warpage
Dishing
Via/TGV Defects
Roughness
The CT600ST Platform -
Single-or Dual-sided concurrent Measurements:
TTV (transparent or opaque)
Warpage
Dishing
Via/TGV Defects
Roughness
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Contact Us
Please contact us for more information and a free system demo
Email us at info@STRAMATEC.com
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